Our bespoke Gap Pads & Sil-Pad are used widely in most electronic applications such as Telecommunications, Computer and peripherals, Power conversion and between heat-generating semiconductors or magnetic components and a heat sink

Some facts on both Gap Pad / Sil-Pad materials:

Gap Pad provides an effective thermal interface between heat sinks and electronic devices where uneven surface topography, air gaps and rough surface textures are present.

Gap Pad provides:

•    Elimination of air gaps to reduce thermal resistance
•    High conformability to reduce interfacial resistance
•    Low-stress vibration dampening
•    Compatible with automated dispensing equipment

Sil-Pad thermally conductive insulators, in their many forms, continue to be a clean and efficient alternative to mica, ceramics or grease for a wide range of electronic applications.

Sil-Pad provides:

•    Excellent thermal performance
•    Eliminates the mess of grease
•    More durable than mica
•    Efficient “total applied cost” that compares favorably with other alternatives.